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| 激光系列产品 >> 热电制冷产品 >> 工业应用的高效单级热电制冷 |
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高效单级热电制冷
工业应用的热电致冷器的主要应用: * 工业电子学和通讯方面的应用 * 具有不同功能的热电冷却组件及调节器 * 碗橱和电子设备用的热电致冷器件 * 不同类型机器的关键部件和组件的温度控制系统 * 热流探测 * 半导体集成为芯片产品 * 激光设备 * 医学设备 * 传送器 * 食品工业 * 特殊设备
Name |
Imax (A) |
Qmax (W) |
Umax (V) |
dTmax (K) |
R (Ohm) |
A (mm) |
B (mm) |
C (mm) |
D (mm) |
H (mm) |
|
3.6 |
36.0 |
16.1 |
71 |
3.20 |
30 |
30 |
30 |
30 |
3.6 |
|
3.6 |
36.0 |
16.1 |
71 |
3.20 |
30 |
30 |
30 |
34 |
3.6 |
|
3.6 |
34.5 |
15.7 |
69 |
3.20 |
40 |
40 |
40 |
40 |
3.6 |
|
3.6 |
36.0 |
16.1 |
71 |
3.20 |
40 |
40 |
40 |
40 |
3.6 |
|
3.8 |
38.0 |
16.7 |
74 |
3.30 |
40 |
40 |
40 |
40 |
4.8 |
|
6.1 |
61.0 |
16.1 |
71 |
2.05 |
40 |
40 |
40 |
40 |
3.9 |
|
6.1 |
61.0 |
16.1 |
71 |
2.05 |
40 |
40 |
40 |
44 |
3.9 |
|
6.2 |
62.0 |
16.3 |
72 |
2.05 |
40 |
40 |
40 |
40 |
3.9 |
|
6.2 |
62.0 |
16.3 |
72 |
2.05 |
40 |
40 |
40 |
44 |
3.9 |
|
6.2 |
64.0 |
16.5 |
73 |
2.05 |
40 |
40 |
40 |
40 |
3.9 |
|
6.2 |
64.0 |
16.5 |
73 |
2.05 |
40 |
40 |
40 |
44 |
3.9 |
|
6.3 |
65.0 |
16.7 |
74 |
2.15 |
40 |
40 |
40 |
40 |
3.9 |
|
6.3 |
65.0 |
16.7 |
74 |
2.15 |
40 |
40 |
40 |
44 |
3.9 |
|
8.0 |
80.0 |
16.1 |
71 |
1.50 |
40 |
40 |
40 |
40 |
3.4 |
|
7.9 |
76.0 |
15.7 |
69 |
1.50 |
48 |
48 |
48 |
48 |
3.4 |
|
8.0 |
80.0 |
16.1 |
71 |
1.50 |
48 |
48 |
48 |
48 |
3.4 |
|
6.1 |
76.0 |
20.1 |
72 |
2.60 |
40 |
40 |
40 |
40 |
3.8 |
|
6.1 |
76.0 |
20.1 |
72 |
2.60 |
40 |
40 |
40 |
44 |
3.8 |
|
4.6 |
57.0 |
20.1 |
72 |
3.30 |
40 |
40 |
40 |
40 |
4.3 |
|
4.6 |
57.0 |
20.1 |
72 |
3.30 |
40 |
40 |
40 |
44 |
4.3 |
|
4.5 |
69.0 |
24.9 |
70 |
4.00 |
40 |
40 |
40 |
40 |
4.4 |
|
6.1 |
94.0 |
24.9 |
70 |
3.20 |
40 |
40 |
40 |
40 |
4.1 |
|
7.6 |
115.0 |
24.6 |
69 |
2.40 |
40 |
40 |
40 |
40 |
3.7 |
|
7.9 |
120.0 |
24.6 |
69 |
2.40 |
40 |
40 |
40 |
40 |
3.6 |
|
8.6 |
131.0 |
24.6 |
69 |
2.15 |
40 |
40 |
40 |
40 |
3.5 |
|
11.3 |
172.0 |
24.6 |
69 |
1.65 |
40 |
40 |
40 |
40 |
3.2 |
|
11.3 |
172.0 |
24.6 |
69 |
1.65 |
35 |
55 |
35 |
55 |
3.2 |
|
11.3 |
172.0 |
24.6 |
69 |
1.65 |
40 |
58 |
40 |
58 |
3.2 |
|
15.1 |
229.3 |
24.6 |
68 |
1.25 |
40 |
40 |
40 |
40 |
3.1 |
|
5.8 |
56.0 |
15.7 |
69 |
2.00 |
40 |
40 |
40 |
40 |
3.2 |
STANDARD TERMS OF DELIVERY:
— substrate material — alumina (ВК-96)
— height tolerance ± 0,05 mm (L1)
— parallelism 0,03 mm (L1)
— wire length 120 mm
— pin orientation (for rectangular coolers) — to the longer side
— processing temperature up to 80°С, maximal assembly temperature 120°С (assembly solder Tm = 139°С)
ADDITIONAL OPTIONS
Description |
Notation (*) |
Note |
processing temperature up to 120 °C, max assembly temperature = 130 °C |
HT(120) |
assembly solder with Tm = 139 °C |
processing temperature up to 150 °C, max assembly temperature = 170 °C |
HT(150) |
assembly solder Pb-Sn with Tm = 183 °C |
processing temperature up to 200 °C, max assembly temperature = 220 °C |
HT(200) |
assembly solder with Tm = 232 °C |
special version for operation under conditions of temperature cycling |
С |
> 105 cycles +40C/+90 °C |
height tolerance = ± 0.025 mm and parallelism 0.02 mm |
L2 |
|
height tolerance = ± 0.015 mm and parallelism 0.01 mm |
L3 |
|
metallization of cold (mc) and (or) hot side of cooler with solder tinning (melting temperature = 95 °C, 117 °C, 139 °C, 183 °C) |
mc95, mh95, mm117 etc. |
|
gold plating |
mcAu, mhAu, mmAu |
metallization Cu-Ni-Au (0.2-1 micron) |
substrate material – aluminium nitride (AlN) |
N |
heat conductivity > 180 W/mK |
sealant: epoxy, silicon, urethane, conformal coating |
E, S, U, Сс |
|
non-standard pin orientation |
|
|
type and length of wires by customer’s requirement |
|
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сonnection to arraies |
|
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сonnectors crimping |
|
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soldering on cold or hot heatsink, packaging or cold block |
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缩写词的定义:
TEC: 热电致冷器
TGM: 热电模块
ΔTmax:热电致冷器的热面和冷面之间可实现的最大温差。
Imax:输入电流到热电致冷器导致最大的ΔTmax
Umax: 在Δtmax,热电致冷器接触的电压
Qmax:热电致冷器的最大冷却能力。当热电致冷器的热面和冷面之间保持温差为零,逐渐升高热电致冷器的电流到最大电流Imax。此时,热电致冷器达到最大冷却能力。
Rac: 在1KHz的交流电测得的热电致冷器的电阻。
工业应用的致冷器
系统符号说明:
通用的缩写被用于标记单级致冷器:
ТВ-N-C-h, 表示:
ТВ — 产品缩写:热电池 (致冷器)。
N — 在制冷器中热电偶的对数
С — 基于热电偶条数的肋骨长度(用毫米表示)
h —基于热电偶条数的高度(用毫米表示)
例如:TB-161-1.4-1.5模块: 161是热电偶对数,(322是热电偶的元素)
每个元素都有1.4mm x 1.4mm的横截面积, 高是1.5mm。
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点击数:4617 录入时间:2008/2/18 【打印此页】 【返回】 |
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